Page All:
Page 1
Microsemi Announces Availability of Space-saving SmartFusion® cSoC Devices
New Chip Scale Package Caters to Growing Miniaturization Needs of Embedded Systems
ALISO VIEJO, Calif., Oct. 4, 2011 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its award-winning SmartFusion® customizable system-on-chip (cSoC) family is now available in a "CS288" 288-ball chip scale package (CSP) package. The new small footprint package is designed for a wide range of industrial, military, communications, medical and computational applications such as security cameras, advanced weapon systems, wearable power supplies, optical transponders, flow monitors, oral x-ray sensors, remote heart monitors and single board computers.
(Logo: http://photos.prnewswire.com/prnh/20110909/MM66070LOGO)
"In today's marketplace, the need for small, thin and lightweight packaging has expanded into industrial and communications applications," said Rich Kapusta, vice president of marketing, SoC Products Group at Microsemi. "The new CS288 package offers exactly that along with a high number of user I/Os, making it ideal for small form-factor embedded systems across a number of industries. We look forward to continuing the expansion of our product offerings to ensure we provide our customers with the innovative embedded solutions they need."
Key features include:
-- Small 11x11 mm square and only 1.05 mm in height
-- Available in leaded & lead-free (RoHS compliant) packages
-- Available in commercial and industrial temperature grades
-- Available across all densities enabling future proofing of designs
-- 135 user IOs including FPGA, microcontroller GPIO and analog I/Os
-- 10/100 Ethernet, external memory controller, with I2C, SPI and UART
interfaces
-- A complete 100 MHz ARM® Cortex-M3(TM) 32-bit microcontroller sub-system
with up to 500K gates of FPGA and feature rich programmable analog
Microsemi's SmartFusion cSoCs are the only devices that integrate an FPGA, a complete microcontroller built around a hard ARM Cortex-M3 processor and programmable analog, enabling full customization, IP protection and ease-of-use. Based on Microsemi's proprietary flash process, SmartFusion devices are ideal for hardware and embedded designers who need a highly integrated SoC that provides more flexibility than traditional fixed-function microcontrollers, and significantly reduces the cost of soft processor cores on traditional FPGAs. For more information, visit http://www.microsemi.com/soc/.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif., and has more than 2,700 employees globally.Learn more at http://www.microsemi.com.
Microsemi and the Microsemi logo and other marks used herein are registered trademarks or service marks of Microsemi Corporation and/or its affiliates; except that third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the availability of its SmartFusion® customizable system-on-chip (cSoC) device in a CS288package, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation
Photo:http://photos.prnewswire.com/prnh/20110909/MM66070LOGO
http://photoarchive.ap.org/
Microsemi Corporation
CONTACT: Gwen Carlson, Director of Marcom/Product PR, +1-949-380-6100, ext. 1835, or Beth P. Quezada, PR Specialist, +1-949-380-6100, ext. 1802, press@microsemi.com
Web Site: http://www.microsemi.com
Microsemi Announces Availability of Space-saving SmartFusion® cSoC Devices
New Chip Scale Package Caters to Growing Miniaturization Needs of Embedded Systems
ALISO VIEJO, Calif., Oct. 4, 2011 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its award-winning SmartFusion® customizable system-on-chip (cSoC) family is now available in a "CS288" 288-ball chip scale package (CSP) package. The new small footprint package is designed for a wide range of industrial, military, communications, medical and computational applications such as security cameras, advanced weapon systems, wearable power supplies, optical transponders, flow monitors, oral x-ray sensors, remote heart monitors and single board computers.
(Logo: http://photos.prnewswire.com/prnh/20110909/MM66070LOGO)
"In today's marketplace, the need for small, thin and lightweight packaging has expanded into industrial and communications applications," said Rich Kapusta, vice president of marketing, SoC Products Group at Microsemi. "The new CS288 package offers exactly that along with a high number of user I/Os, making it ideal for small form-factor embedded systems across a number of industries. We look forward to continuing the expansion of our product offerings to ensure we provide our customers with the innovative embedded solutions they need."
Key features include:
-- Small 11x11 mm square and only 1.05 mm in height
-- Available in leaded & lead-free (RoHS compliant) packages
-- Available in commercial and industrial temperature grades
-- Available across all densities enabling future proofing of designs
-- 135 user IOs including FPGA, microcontroller GPIO and analog I/Os
-- 10/100 Ethernet, external memory controller, with I2C, SPI and UART
interfaces
-- A complete 100 MHz ARM® Cortex-M3(TM) 32-bit microcontroller sub-system
with up to 500K gates of FPGA and feature rich programmable analog
Microsemi's SmartFusion cSoCs are the only devices that integrate an FPGA, a complete microcontroller built around a hard ARM Cortex-M3 processor and programmable analog, enabling full customization, IP protection and ease-of-use. Based on Microsemi's proprietary flash process, SmartFusion devices are ideal for hardware and embedded designers who need a highly integrated SoC that provides more flexibility than traditional fixed-function microcontrollers, and significantly reduces the cost of soft processor cores on traditional FPGAs. For more information, visit http://www.microsemi.com/soc/.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif., and has more than 2,700 employees globally.Learn more at http://www.microsemi.com.
Microsemi and the Microsemi logo and other marks used herein are registered trademarks or service marks of Microsemi Corporation and/or its affiliates; except that third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the availability of its SmartFusion® customizable system-on-chip (cSoC) device in a CS288package, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation
Photo:http://photos.prnewswire.com/prnh/20110909/MM66070LOGO
http://photoarchive.ap.org/
Microsemi Corporation
CONTACT: Gwen Carlson, Director of Marcom/Product PR, +1-949-380-6100, ext. 1835, or Beth P. Quezada, PR Specialist, +1-949-380-6100, ext. 1802, press@microsemi.com
Web Site: http://www.microsemi.com