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Maxim Introduces Third-Generation TINI® Power SoC Chipset for Smaller, Thinner, and More Energy-Efficient Smartphones
New TINI Power SoC chipset is optimized for the Exynos 4412 applications processor and powers the Galaxy S III.
SUNNYVALE, Calif., June 19, 2012 /PRNewswire/ -- Maxim Integrated Products, Inc. (NASDAQ: MXIM) announced that its newest Power SoC chipset in the Galaxy S® III operates with the Exynos 4412 quad-core applications processor to provide a smaller, much thinner, and significantly more efficient smartphone.
(Logo: http://photos.prnewswire.com/prnh/20120117/SF36500LOGO)
Maxim's newest Power SoC chipset covers all power management, charging, and USB multiplexing needs. It provides an optimized balance between size and flexibility to power the Samsung® applications processor and baseband processor. It maximizes battery usage and enhances USB connectivity. Managing the power for upwards of 60 channels, the chipset offers up to 20 percent more conversion efficiency compared to the previous generation. Maxim's unique Green Mode regulators and subregulation architecture, along with the company's proprietary low-power, submicron geometry process, extend standby and active battery life. The chipset also enables fastest battery charging with minimal heat generation. High integration and advanced design techniques reduce the size, thickness, and number of external components so smartphones become even thinner.
Chipset Features
-- One Power SoC is optimized to efficiently power the Exynos 4412
applications processor.
-- The second Power SoC powers the LTE (4G) baseband processor for faster,
more reliable data and voice.
-- The third Power SoC provides numerous integrated functions, including a
battery charger, a haptic motor driver, high-accuracy ModelGauge®
technology that maximizes battery usage, and the ability to use a single
USB connector for charging or connecting accessories.
Comments
-- "Customers are demanding the smallest possible, most-efficient power
solution, so end users can enjoy all-day use of the latest multimedia
features," said Chae Lee, Senior Vice President, Mobility Group at Maxim
Integrated Products. "Our Power SoC enables a 30 percent reduction in
power solution size, while increasing efficiency by up to 20 percent
compared to the previous generation."
Customers interested in using the Power SoC chipset to develop highly integrated smartphones should contact their Maxim sales representative. For more information about TINI Power SoCs, click here.
About Maxim Integrated Products
Maxim makes highly integrated analog and mixed-signal semiconductors. Maxim reported revenue of approximately $2.5 billion for fiscal 2011. For more information, go to http://www.maxim-ic.com.
ModelGauge is a trademark and TINI is a registered trademark of Maxim Integrated Products, Inc. All other trademarks are the property of their respective owners.
CONTACT: Ferda Millan
408-601-5429
Ferda.Millan@maxim-ic.com
SOURCE Maxim Integrated Products
Maxim Integrated Products
Maxim Introduces Third-Generation TINI® Power SoC Chipset for Smaller, Thinner, and More Energy-Efficient Smartphones
New TINI Power SoC chipset is optimized for the Exynos 4412 applications processor and powers the Galaxy S III.
SUNNYVALE, Calif., June 19, 2012 /PRNewswire/ -- Maxim Integrated Products, Inc. (NASDAQ: MXIM) announced that its newest Power SoC chipset in the Galaxy S® III operates with the Exynos 4412 quad-core applications processor to provide a smaller, much thinner, and significantly more efficient smartphone.
(Logo: http://photos.prnewswire.com/prnh/20120117/SF36500LOGO)
Maxim's newest Power SoC chipset covers all power management, charging, and USB multiplexing needs. It provides an optimized balance between size and flexibility to power the Samsung® applications processor and baseband processor. It maximizes battery usage and enhances USB connectivity. Managing the power for upwards of 60 channels, the chipset offers up to 20 percent more conversion efficiency compared to the previous generation. Maxim's unique Green Mode regulators and subregulation architecture, along with the company's proprietary low-power, submicron geometry process, extend standby and active battery life. The chipset also enables fastest battery charging with minimal heat generation. High integration and advanced design techniques reduce the size, thickness, and number of external components so smartphones become even thinner.
Chipset Features
-- One Power SoC is optimized to efficiently power the Exynos 4412
applications processor.
-- The second Power SoC powers the LTE (4G) baseband processor for faster,
more reliable data and voice.
-- The third Power SoC provides numerous integrated functions, including a
battery charger, a haptic motor driver, high-accuracy ModelGauge®
technology that maximizes battery usage, and the ability to use a single
USB connector for charging or connecting accessories.
Comments
-- "Customers are demanding the smallest possible, most-efficient power
solution, so end users can enjoy all-day use of the latest multimedia
features," said Chae Lee, Senior Vice President, Mobility Group at Maxim
Integrated Products. "Our Power SoC enables a 30 percent reduction in
power solution size, while increasing efficiency by up to 20 percent
compared to the previous generation."
Customers interested in using the Power SoC chipset to develop highly integrated smartphones should contact their Maxim sales representative. For more information about TINI Power SoCs, click here.
About Maxim Integrated Products
Maxim makes highly integrated analog and mixed-signal semiconductors. Maxim reported revenue of approximately $2.5 billion for fiscal 2011. For more information, go to http://www.maxim-ic.com.
ModelGauge is a trademark and TINI is a registered trademark of Maxim Integrated Products, Inc. All other trademarks are the property of their respective owners.
CONTACT: Ferda Millan
408-601-5429
Ferda.Millan@maxim-ic.com
SOURCE Maxim Integrated Products
Maxim Integrated Products