Microsemi Adds Radiation-tolerant Source Driver to Space Portfolio

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July 9, 2012
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Microsemi Adds Radiation-tolerant Source Driver to Space Portfolio

New Devices Support -55 to 125 degrees C Operating Temperatures

ALISO VIEJO, Calif., July 9, 2012 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced the first in a new family of octal source driver integrated circuits for aerospace and other high-reliability power electronics control applications including motor control. The AAHS298B is radiation-tolerant to 100kRad (Si) total dose and screened to meet operating temperatures ranging from -55 to 125 degrees Celsius and class S and class B screening levels. The new driver can be used in conjunction with Microsemi's radiation-hardened and -tolerant programmable logic products and diodes to easily implement redundant power management solutions.

(Logo: http://photos.prnewswire.com/prnh/20110909/MM66070LOGO)

The AAHS298B includes eight non-inverting channels and can be used to provide an interface from TTL level, five volt (V) or 12V logic systems to relays, stepper and servo motors, solenoids and other loads. Each output is capable of sourcing 700 milliamps (mA) with a withstand voltage of 50V across the full military operating range, allowing manufacturers to develop more compact solutions. It includes an internal thermal shutdown feature to protect against over-current and soft-start occurrences. Additional features include:

    --  Single event latch-up (SEL) immune
    --  Low quiescent current consumption
    --  Internal ground clamp diodes
    --  Output breakdown voltage of 50V (minimum)
    --  Transistor-transistor logic (TTL), 5V and 12V logic compatible
Microsemi's radiation-tolerant and -hardened solutions portfolio includes: ICs; FPGAs; power supplies; MOSFETs; bipolar transistors and diodes; solar diodes; hybrids; and integrated custom product that include solutions with multiple organizations of memories, gate arrays and processors in various hermetically-sealed ceramic packages.

Availability and Packaging
The AAHS298B source driver is available in production now and is packaged in a 20-pin ceramic small-outline integrated circuit (SOIC) package. For more information, visit http://www.microsemi.com/en/node/124816.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense and security, aerospace, as well as industrial and medical markets. Products include mixed-signal integrated circuits, SoCs and ASICS; programmable logic solutions; power management products; timing and voice processing devices; RF solutions; discrete components; and Power-over-Ethernet ICs and midspans. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at http://www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new AAHS298B octal source driver, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

SOURCE  Microsemi Corporation

Photo:http://photos.prnewswire.com/prnh/20110909/MM66070LOGO
http://photoarchive.ap.org/
Microsemi Corporation

CONTACT: Gwen Carlson, Director, Corporate Communications, +1-949-380-6135; Beth P. Quezada, Communications Specialist, +1-949-380-6102, press@microsemi.com

Web Site: http://www.microsemi.com

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