=?ISO-8859-1?Q?TI_expands_its_CC2560_and_CC2564?= =?ISO-8859-1?Q?_Bluetooth=AE_wireless_connectivity?= =?ISO-8859-1?Q?_portfolio_with_QFN_packages,_mor?= =?ISO-8859-1?Q?e_module_designs_and_new_softwa
Poster: SySAdmin
Posted on October 25, 2012 at 8:21:01 AM
TI expands its CC2560 and CC2564 Bluetooth® wireless connectivity portfolio with QFN packages, more module designs and new software
Audio, sports and fitness, smart watch and phone accessory applications benefit from easy integration and greater flexibility for microcontroller designs adding Bluetooth and Bluetooth low energy connectivity
DALLAS, Oct. 25, 2012 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NASDAQ: TXN), leading the industry with the most complete wireless connectivity portfolio for embedded applications, today announced that its Bluetooth® v4.0 technology-based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages offered by TI and its distribution partners. TI also announced the availability of additional production-ready modules based on the two devices, as well as software and tools. The QFN packages and various modules give customers choice regarding power, size and cost requirements. For more information, visit http://www.ti.com/bluetoothqfn-pr.
QFN packages and kits
The ROHS-compliant QFN packages of the CC2560 and CC2564 Bluetooth v4.0 devices are available today through TI and its distributors. To further help design efforts, TI encourages customers to download from its wiki a two-layer reference design (schematics, layout and bill of materials) that can be copied and pasted into end applications.
TI will release full-featured evaluation boards and design materials for hardware and software prototyping with the CC2560 and CC2564 QFN devices later this quarter.
Production-ready modules and kits
In addition to the two modules previously announced, four new complete, validated and certified modules are now available from TI partners. The modules vary in size, temperature range and output power--including Class 1 and Class 2 versions. One module also offers a pre-integrated MCU plus CC2564 solution for faster development.
Software development kits for Bluetooth and Bluetooth/Bluetooth low energy solutions are currently available. Customers can also access sample applications and demos provided in source code showing API usage.
Software for QFN devices and modules
A royalty-free Bluetooth stack and various profiles are provided pre-integrated on MCUs such as TI's ultra-low power MSP430((TM)) MCU and Stellaris(®) ARM(®) Cortex((TM))-M3/M4 MCUs.
TI will also release an updated Bluetooth stack in mid-4Q 2012. The new stack will offer flexible software build options that will enable customers to select specific profiles to support. This capability allows for greater memory size optimization and the ability to support a broader range of MCUs.
Complete information including getting started guides, documentation and support for all CC2560 and CC2564 solutions can be found at http://www.ti.com/connectivitywiki.
Features and benefits of the CC2560 and CC2564 portfolio
The CC2560 device offers Bluetooth v4.0 "classic" support for audio and data applications requiring high throughput. The CC2564 device supports two options: dual-mode Bluetooth/Bluetooth low energy or dual-mode Bluetooth/ANT+. Applications that benefit from the dual-mode solution include those that require wireless communication to Bluetooth "classic" products and Bluetooth low energy or ANT+ devices such as sports and fitness aggregator gadgets or smart watches. The dual-mode Bluetooth v4.0 solution can also be used as a sensor solution that delivers longer range to communicate with mobile devices that may or may not have Bluetooth low energy technology.
Features Benefits
-------- --------
Bluetooth v4.0 support (Bluetooth and Bluetooth low energy 2x range over competitive Bluetooth low energy
dual-mode) Best-in-class Bluetooth RF performanceTI's solutionsRobust, high throughput wireless
proven 7th generation Bluetooth technology connecitivity with extended range and power
efficiency
---------------------------------------------------------- ----------------------------------------------
Royalty-free Bluetooth software stack offered from TI and Simplified and minimized hardware and software
developed by Stonestreet One Supports various development for quick time-to-marketAllows for
microcontrollers such as TI's MSP430 and Stellaris MCUs extensive application prototyping and development
--------------------------------------------------------- -------------------------------------------------
Availability and pricing
The QFN solutions are available today on the TI eStore and through authorized TI distributors:
Device Part Size Price
------ ---- ---- -----
CC2560 (QFN) CC2560ARVMR Device: 7.83 x 8.10 mm $1.86 for 1K units
CC2560ARVMT Design: 16.5x16.5 mm
--- ----------- --------------------
CC2564 (QFN) CC2564ARVMR Device: 7.83 x 8.10 mm $2.14 for 1K units
CC2564ARVMT Design: 16.5x16.5 mm
--- ----------- --------------------
More details on TI's QFN solution including design guide, testing guide, datasheet, software download and a Bluetooth hardware evaluation tool can be found here.
Production-ready Bluetooth classic and dual-mode modules from TI partners include:
Partner TI device Part number Product page
------- --------- ----------- ------------
Panasonic CC2560 PAN1325A/15A http://www.panasonic.com/industrial/electronic-components/rf-modules/bluetooth/pan1325a-1315a.aspx
--------- ------ ------------ --------------------------------------------------------------------------------------------------
Panasonic CC2564 PAN1326/16 http://www.panasonic.com/industrial/electronic-components/rf-modules/bluetooth/pan1326-1316.aspx
--------- ------ ---------- ------------------------------------------------------------------------------------------------
Murata CC2560 SN2100 (Class 1) http://www.murata-ws.com/sn2100.htm
------ ------ --------------- -----------------------------------
Murata CC2564 LBMA1BGUG2 (Class 2) http://www.murata-ws.com/type-ug.htm
------ ------ ------------------- ------------------------------------
LS Research CC2564 450-0104 http://www.lsr.com/wireless-products/tiwi-ub2
----------- ------ -------- ---------------------------------------------
BlueRadios,
Inc. CC2564 + BR-LE4.0-D2A http://www.blueradios.com/hardware_LE4.0-D2.htm
MSP430F5438
--- -----------
More details on the above modules can be found here.
Find out more about TI's wireless connectivity solutions
-- TI's Bluetooth solutions: http://www.ti.com/Bluetooth
-- TI's wireless connectivity wiki: http://www.ti.com/connectivitywiki
-- TI's wireless connectivity selection guide:
http://www.ti.com/wirelessconnectivityguide
-- TI E2E(TM) support community: http://www.ti.com/wiconforum
About Texas Instruments
Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be - smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do - from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at http://www.ti.com.
Trademarks
Stellaris is a registered trademark and MSP430 and TI E2E are trademarks of Texas Instruments. All other trademarks belong to their respective owners.
SOURCE Texas Instruments
Photo:http://photos.prnewswire.com/prnh/20010105/NEF016LOGO
http://photoarchive.ap.org/
Texas Instruments
CONTACT: Marisa Speziale, GolinHarris, +1-972-341-2521, mspeziale@golinharris.com; Helana Zhang, Texas Instruments, +1-214-479-3107, helana.zhang@ti.com
Web Site: http://www.ti.com
Audio, sports and fitness, smart watch and phone accessory applications benefit from easy integration and greater flexibility for microcontroller designs adding Bluetooth and Bluetooth low energy connectivity
DALLAS, Oct. 25, 2012 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NASDAQ: TXN), leading the industry with the most complete wireless connectivity portfolio for embedded applications, today announced that its Bluetooth® v4.0 technology-based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages offered by TI and its distribution partners. TI also announced the availability of additional production-ready modules based on the two devices, as well as software and tools. The QFN packages and various modules give customers choice regarding power, size and cost requirements. For more information, visit http://www.ti.com/bluetoothqfn-pr.
QFN packages and kits
The ROHS-compliant QFN packages of the CC2560 and CC2564 Bluetooth v4.0 devices are available today through TI and its distributors. To further help design efforts, TI encourages customers to download from its wiki a two-layer reference design (schematics, layout and bill of materials) that can be copied and pasted into end applications.
TI will release full-featured evaluation boards and design materials for hardware and software prototyping with the CC2560 and CC2564 QFN devices later this quarter.
Production-ready modules and kits
In addition to the two modules previously announced, four new complete, validated and certified modules are now available from TI partners. The modules vary in size, temperature range and output power--including Class 1 and Class 2 versions. One module also offers a pre-integrated MCU plus CC2564 solution for faster development.
Software development kits for Bluetooth and Bluetooth/Bluetooth low energy solutions are currently available. Customers can also access sample applications and demos provided in source code showing API usage.
Software for QFN devices and modules
A royalty-free Bluetooth stack and various profiles are provided pre-integrated on MCUs such as TI's ultra-low power MSP430((TM)) MCU and Stellaris(®) ARM(®) Cortex((TM))-M3/M4 MCUs.
TI will also release an updated Bluetooth stack in mid-4Q 2012. The new stack will offer flexible software build options that will enable customers to select specific profiles to support. This capability allows for greater memory size optimization and the ability to support a broader range of MCUs.
Complete information including getting started guides, documentation and support for all CC2560 and CC2564 solutions can be found at http://www.ti.com/connectivitywiki.
Features and benefits of the CC2560 and CC2564 portfolio
The CC2560 device offers Bluetooth v4.0 "classic" support for audio and data applications requiring high throughput. The CC2564 device supports two options: dual-mode Bluetooth/Bluetooth low energy or dual-mode Bluetooth/ANT+. Applications that benefit from the dual-mode solution include those that require wireless communication to Bluetooth "classic" products and Bluetooth low energy or ANT+ devices such as sports and fitness aggregator gadgets or smart watches. The dual-mode Bluetooth v4.0 solution can also be used as a sensor solution that delivers longer range to communicate with mobile devices that may or may not have Bluetooth low energy technology.
Features Benefits
-------- --------
Bluetooth v4.0 support (Bluetooth and Bluetooth low energy 2x range over competitive Bluetooth low energy
dual-mode) Best-in-class Bluetooth RF performanceTI's solutionsRobust, high throughput wireless
proven 7th generation Bluetooth technology connecitivity with extended range and power
efficiency
---------------------------------------------------------- ----------------------------------------------
Royalty-free Bluetooth software stack offered from TI and Simplified and minimized hardware and software
developed by Stonestreet One Supports various development for quick time-to-marketAllows for
microcontrollers such as TI's MSP430 and Stellaris MCUs extensive application prototyping and development
--------------------------------------------------------- -------------------------------------------------
Availability and pricing
The QFN solutions are available today on the TI eStore and through authorized TI distributors:
Device Part Size Price
------ ---- ---- -----
CC2560 (QFN) CC2560ARVMR Device: 7.83 x 8.10 mm $1.86 for 1K units
CC2560ARVMT Design: 16.5x16.5 mm
--- ----------- --------------------
CC2564 (QFN) CC2564ARVMR Device: 7.83 x 8.10 mm $2.14 for 1K units
CC2564ARVMT Design: 16.5x16.5 mm
--- ----------- --------------------
More details on TI's QFN solution including design guide, testing guide, datasheet, software download and a Bluetooth hardware evaluation tool can be found here.
Production-ready Bluetooth classic and dual-mode modules from TI partners include:
Partner TI device Part number Product page
------- --------- ----------- ------------
Panasonic CC2560 PAN1325A/15A http://www.panasonic.com/industrial/electronic-components/rf-modules/bluetooth/pan1325a-1315a.aspx
--------- ------ ------------ --------------------------------------------------------------------------------------------------
Panasonic CC2564 PAN1326/16 http://www.panasonic.com/industrial/electronic-components/rf-modules/bluetooth/pan1326-1316.aspx
--------- ------ ---------- ------------------------------------------------------------------------------------------------
Murata CC2560 SN2100 (Class 1) http://www.murata-ws.com/sn2100.htm
------ ------ --------------- -----------------------------------
Murata CC2564 LBMA1BGUG2 (Class 2) http://www.murata-ws.com/type-ug.htm
------ ------ ------------------- ------------------------------------
LS Research CC2564 450-0104 http://www.lsr.com/wireless-products/tiwi-ub2
----------- ------ -------- ---------------------------------------------
BlueRadios,
Inc. CC2564 + BR-LE4.0-D2A http://www.blueradios.com/hardware_LE4.0-D2.htm
MSP430F5438
--- -----------
More details on the above modules can be found here.
Find out more about TI's wireless connectivity solutions
-- TI's Bluetooth solutions: http://www.ti.com/Bluetooth
-- TI's wireless connectivity wiki: http://www.ti.com/connectivitywiki
-- TI's wireless connectivity selection guide:
http://www.ti.com/wirelessconnectivityguide
-- TI E2E(TM) support community: http://www.ti.com/wiconforum
About Texas Instruments
Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be - smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do - from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at http://www.ti.com.
Trademarks
Stellaris is a registered trademark and MSP430 and TI E2E are trademarks of Texas Instruments. All other trademarks belong to their respective owners.
SOURCE Texas Instruments
Photo:http://photos.prnewswire.com/prnh/20010105/NEF016LOGO
http://photoarchive.ap.org/
Texas Instruments
CONTACT: Marisa Speziale, GolinHarris, +1-972-341-2521, mspeziale@golinharris.com; Helana Zhang, Texas Instruments, +1-214-479-3107, helana.zhang@ti.com
Web Site: http://www.ti.com