ASE Labs
Welcome Guest. Please register or log in now. There are 66 people online (0 Friends).
  • Home
  • Articles
  • News
  • Forum
  • Register/Login

=?WINDOWS-1252?Q?Qualcomm_Announces_Next_Gene?= =?WINDOWS-1252?Q?ration_Biometrics_Solution_wi?= =?WINDOWS-1252?Q?th_its_New_Snapdragon_Sense=99?= =?WINDOWS-1252?Q?_ID_3D_Fingerprint_Technology?=

Poster: SySAdmin
Posted on March 2, 2015 at 3:35:01 AM
Qualcomm Announces Next Generation Biometrics Solution with its New Snapdragon Sense(TM) ID 3D Fingerprint Technology

- Company Extends Security Leadership with Mobile Industry's First Comprehensive 3D Fingerprint Authentication Solution based on Ultrasonic Technology -

BARCELONA, Spain, March 2, 2015 /PRNewswire/ -- Qualcomm Technologies, Inc. (QTI), a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), is extending its mobile security leadership with the launch of Qualcomm(®) Snapdragon Sense(TM) ID 3D Fingerprint Technology, the mobile industry's first 3D fingerprint authentication technology based on ultrasonic technology. QTI's offering is designed to provide enhanced authentication capabilities, usability and integration over legacy capacitive touch-based fingerprint technologies by utilizing technology developed for government-grade biometric solutions. This new authentication platform utilizes Qualcomm® SecureMSM((TM)) technology and the FIDO (Fast IDentity Online) Alliance Universal Authentication Framework (UAF) specification to provide password-less authentication, further improving interoperability among online devices and addressing the challenge of creating and remembering multiple usernames and passwords. This new standard for mobile device authentication and browser plug-ins is designed to allow any website or cloud application that offers FIDO authentication to interface with a broad variety of existing and future FIDO devices.     

QTI's ultrasonic fingerprint technology has a number of distinct advantages over capacitive touch-based fingerprint technologies, including the ability to scan through a smartphone cover that is made of glass, aluminum, stainless steel, sapphire and plastics. This distinct and valuable advantage provides QTI's OEM customers with the flexibility to design a new generation of elegant, innovative and differentiated devices. The user experience is also improved by being able to scan through various contaminants that might be present on the finger, such as sweat, hand lotion and condensation, providing a more consistent and accurate method of authentication. Additionally, QTI's ultrasonic-based solution uses sound waves to directly penetrate the outer layers of skin, detecting three-dimensional details and unique fingerprint characteristics, including fingerprint ridges and sweat pores that are not possible to detect with current capacitive touch-based fingerprint technologies. The result is a highly detailed surface map of the fingerprint which is difficult to imitate or spoof.

"Mobile devices increasingly store our most valuable and sensitive information, while passwords alone do not provide the protection consumers deserve," said Raj Talluri, senior vice president, product management, QTI. "Snapdragon Sense ID 3D Fingerprint Technology's unique use of ultrasonic technology revolutionizes biometrics from 2D to 3D, allowing for greater accuracy, privacy and stronger authentication. We are very proud to bring the mobile industry's first ultrasonic-based biometric authentication technology to mobile device manufacturers and their customers, who will benefit from the improved and differentiated user experience."

QTI's Snapdragon Sense ID 3D Fingerprint Technology consists of a Qualcomm biometric integrated circuit (QBIC), custom sensor technology, and algorithms managed by SecureMSM technology, which is at the foundation of all of QTI's security features that helps to secure user privacy and personal data on-device. This groundbreaking technology is being introduced in conjunction with the Snapdragon 810 and Snapdragon 425 processors. Snapdragon Sense ID 3D fingerprint technology is designed to be compatible with all Snapdragon 400 series, 600 series and 800 series processors.

Additionally, QTI is supporting further biometric authentication advancements by serving on the FIDO Alliance and IBIA (International Biometric Industry Association) Board of Directors and working closely with other ecosystem leaders to effectively create leading innovative biometrics solutions. QTI's revolutionary Snapdragon Sense ID 3D Fingerprint Technology, based on QTI's own unique client technology together with Nok Nok Labs' S3 Authentication Suite provides the mobile industry's first password-less authentication based on ultrasonic technology, paving the way for future biometric authentication advancements.

Qualcomm Snapdragon Sense ID 3D Fingerprint Technology is expected to be available in commercial devices later this year and is already in various sampling stages with most major OEMs.

About Qualcomm Incorporated

Qualcomm Incorporated (NASDAQ: QCOM) is a world leader in 3G, 4G and next-generation wireless technologies. Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses, including its semiconductor business, QCT. For more than 25 years, Qualcomm ideas and inventions have driven the evolution of digital communications, linking people everywhere more closely to information, entertainment and each other. For more information, visit Qualcomm's website,OnQ blog,Twitter and Facebook pages.

Qualcomm, Snapdragon, and SecureMSM are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Snapdragon Sense is a trademark of Qualcomm Incorporated.   

Qualcomm Contacts:
Jon Carvill, Corporate Communications
Phone: 1-858-658-1993
Email: corpcomm@qualcomm.com

Warren Kneeshaw, Investor Relations
Phone: 1-858-658-4813
Email: ir@qualcomm.com

SOURCE  Qualcomm Technologies, Inc.

Qualcomm Technologies, Inc.

Web Site: http://www.qualcomm.com
 
Print This Entry
Tags PR Press Release
Related Articles
  • Huntkey Has Launched Its New Power Strips with USB Chargers on Amazon US
  • Inspur Releases TensorFlow-Supported FPGA Compute Acceleration Engine TF2
  • Hot Pepper Introduces Spicy New Smartphones in US Markets
  • Sharp Introduces New Desktop Printers For The Advanced Office
  • DJI Introduces Mavic 2 Pro And Mavic 2 Zoom: A New Era For Camera Drones
Login
Welcome Guest. Please register or log in now.
Forgot your password?
Navigation
  • Home
  • Articles
  • News
  • Register/Login
  • Shopping
  • ASE Forums
  • Anime Threads
  • HardwareLogic
  • ASE Adnet
Latest News
  • Kingston HyperX Cloud 2 Pro Gaming Headset Unboxing
  • Synology DS415+ Unboxing
  • D-Link DCS-5020L Wireless IP Pan/Tilt IP Camera
  • Actiontec WiFi Powerline Network Extender Kit Unboxing
  • Durovis Dive Unboxing
  • Bass Egg Verb Unboxing
  • Welcome to the new server
  • Gmail Gets Optional Preview Pane
  • HBO Go on Consoles
  • HP Touchpad Update
Latest Articles
  • D-Link Exo AC2600 Smart Mesh Wi-Fi Router DIR-2660-US
  • HyperX Double Shot PBT Keys
  • Avantree ANC032 Wireless Active Noise Cancelling Headphones
  • ScharkSpark Beginner Drones
  • HyperX Alloy FPS RGB Mechanical Gaming Keyboard
  • D-Link DCS-8300LH Full HD 2-Way Audio Camera
  • Contour Unimouse Wireless Ergonomic Mouse
  • HyperX Cloud Alpha Pro Gaming Headset
  • Linksys Wemo Smart Home Suite
  • Fully Jarvis Adjustable Standing Desk
Latest Topics
  • Hello
  • Welcome to the new server at ASE Labs
  • Evercool Royal NP-901 Notebook Cooler at ASE Labs
  • HyperX Double Shot PBT Keys at ASE Labs
  • Avantree ANC032 Wireless Active Noise Cancelling Headphones at ASE Labs
  • ScharkSpark Beginner Drones at ASE Labs
  • HyperX Alloy FPS RGB Mechanical Gaming Keyboard at ASE Labs
  • D-Link DCS-8300LH Full HD 2-Way Audio Camera at ASE Labs
  • Kingston SDX10V/128GB SDXC Memory at ASE Labs
  • What are you listening to now?
  • Antec Six Hundred v2 Gaming Case at HardwareLogic
  • Sans Digital TR5UTP 5-Bay RAID Tower at HardwareLogic
  • Crucial Ballistix Smart Tracer 6GB PC3-12800 BL3KIT25664ST1608OB at HardwareLogic
  • Cooler Master Storm Enforcer Mid-Tower Gaming Case at HardwareLogic
  • Arctic M571-L Gaming Laser Mouse at ASE Labs
  • Contour Unimouse Wireless Ergonomic Mouse at ASE Labs
Advertisement
Advertisement
Press Release
  • Huntkey Has Launched Its New Power Strips with USB Chargers on Amazon US
  • Inspur Releases TensorFlow-Supported FPGA Compute Acceleration Engine TF2
  • Hot Pepper Introduces Spicy New Smartphones in US Markets
  • Sharp Introduces New Desktop Printers For The Advanced Office
  • DJI Introduces Mavic 2 Pro And Mavic 2 Zoom: A New Era For Camera Drones
  • DJI Introduces Mavic 2 Pro And Mavic 2 Zoom: A New Era For Camera Drones
  • Fujifilm launches "instax SQUARE SQ6 Taylor Swift Edition", designed by instax global partner Taylor Swift
  • Huawei nova 3 With Best-in-class AI Capabilities Goes on Sale Today
  • Rand McNally Introduces Its Most Advanced Dashboard Camera
  • =?UTF-8?Q?My_Size_to_Showcase_Its_MySizeId=E2=84=A2_Mobil?= =?UTF-8?Q?e_Measurement_Technology_at_CurvyCon_NYC?=
Home - ASE Publishing - About Us
© 2010 Aron Schatz (ASE Publishing) [Queries: 16 (8 Cached)] [Rows: 292 Fetched: 35] [Page Generation time: 0.12340784072876]